Company Profile
M I D - The 3. dimension of your PCB
- Metalisation of plastics in nearly any shape
- Use of PEI, PBT, PA6, Carbon etc. for high temperature applications
- Use of the 3. dimension for assembling of devices or the routing of leadings
- Housing as "integrated PCB" usable
- Reduction of surface, use of SMD possible
- Use of the housing for the shielding of a complete function unit
- Structure implemented by LASER or by photo chemical procedure
The realisation for your next project -
we create your solution
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(c) K.Piekarski 1999